Joule heating simulation - faster
Joule heating solver improvements have been made resulting in significant simulation speed up. Tests indicate a speed up of between 4 -10 times faster


The impact is obviously model dependent. However, such solve time reduction allows for greater opportunity to evaluate critical joule heating influences in more complex models during development.
Accurate electrothermal circuit simulation earlier with BCI-ROMs in VHDL-AMS format


Building on increasing demand for accuracy in electrothermal circuit simulation environments, and earlier, closer electrical-thermal design workflow, Simcenter Flotherm 2020.2 adds generation of BCI-ROMs in VHDL-AMS format. VHDL-AMS is built on IEEE Standard 1076.1 and is a hardware description language used in multi-domain simulation of analog, digital, and mixed-signal systems. This BCI-ROM format better supports transient modeling of operating modes and power-aware control in a circuit simulation tool. It extends beyond the VHDL-AMS thermal netlist generation capabilities introduced in the prior Simcenter Flotherm 2020.1 release. The thermal model supply chain from semiconductor OEM to electronics integrator is better connected for electrothermal circuit simulation tasks as result.
In short, the "boundary condition independent" aspect of reduced order models is extremely valuable, as this enables BCI-ROMs to be used in any thermal environment, while maintaining accuracy. It makes connected electrical and thermal circuit concurrent modeling achievable. With this release, BCI-ROM technology now supports both BCI-ROM and Thermal Netlist generation in VHDL-AMS and spice format for use with circuit simulation tools such as SystemVision Cloud, Xpedition AMS and many others.
Further reduced order modeling enhancements, including for 1D system simulation
Simcenter Flotherm BCI-ROM technology creates fast solving, accurate reduced order models from a 3D conduction thermal model and can be utilized in several different formats. Formats generated can run in 3rd party numerical computational tools to solve BCI-ROM matrices, in circuit simulation modeling tools (see above) and also in 1D system modeling tools (FMU format). Now it is possible also to solve BCI-ROM matrices for fast transient thermal studies in a Simcenter Flotherm standalone utility.


New Command line utility to solve BCI ROM Matrices
Simcenter Flotherm 2020.2 introduces a command line utility "BCI-ROM Matrices Standalone Solver for Simcenter Flotherm" which complements existing methods utilizing solver harnesses in 3rd party software tools. The standalone utility installs as an executable with the software. To generate BCI-ROM matrices, you simply select export option "Matrices" in the preferences window.
BCI-ROM Export option to create the Functional Mock Up (FMU) for System Simulation
BCI-ROM generation in FMU format for system simulation tools such as Simcenter Flomaster , Simcenter Amesim and others was introduced at Simcenter Flotherm 2020.1. Now in version 2020.2, generation is much easier within the interface, by selecting FMU directly as an export option rather than via a command line utility.
BCI-ROM FMU Video example: As a recap of one example of using Simcenter Flotherm generated BCI-ROMs in FMU format, I refer you to this video on a liquid cooling simulation performed in Simcenter Flomaster.








Other Simcenter Flotherm 2020.2 enhancements
Export Cell by Cell Results easily
You can now export cell by cell results easily in 2 ways that will generate a csv file when in analyze mode.



Important for clients: Select Beta features are available to preview in this software release.




The powerful FloTHERM suite of 3D computational fluid dynamics (CFD) software predicts airflow and heat transfer, in and around electronic equipment. FloTHERM delivers right-by-design products that save design time and reduce the need for physical prototyping from components and boards to complete systems and data centers.
FloTHERM is the market-leading electronics cooling simulation software with more installed seats than all other electronics cooling CFD software. For over 25 years FloTHERM has supported a huge customer base, including almost all the major blue-chip electronics companies in the world. FloTHERM supports chip, package, board and system design, and even extends out to datacenters. It is designed as a vertically-specialized solution for the electronics thermal market through its innovative SmartPart technology, extensive libraries, tailored and stable solution technology, state-of-the art compact thermal modeling techniques and parametric analysis & optimization functionality. FloTHERM features advanced interfacing technologies for working with EDA data from Mentor Graphics, Cadence and Zuken and is backed by a family of ancillary solutions for PCB (FloTHERM PCB) and package modeling (FloTHERM PACK and FloTHERM IC).
Fast electronics cooling simulation






Mentor Graphics, a Siemens Business, is a world leader in electronic hardware and software design solutions, providing products, consulting services and award-winning support for the world's most successful electronic, semiconductor and systems companies. We enable companies to develop better electronic products faster and more cost-effectively. Our innovative products help conquer complex design challenges. Mentor is technology leader in full chip emulation, Functional Verification, Design-for-Test and physical verification with its Veloce, Questa, Tessent and Calibre platforms.
Product: Siemens Simcenter FloTHERM
Version: 2020.2
Supported Architectures: x64
Website Home Page : www.mentor.com
Language: english
System Requirements: PC *
Size: 1.0 Gb


Hardware and OS Requirements
- Windows Server 2019 Version 1809, Standard Edition
- Windows Server 2016 Version 1607, Standard Edition
- Windows 10 Creators Update Versions 1909 and 2004 (Pro and Enterprise)
Hardware Requirements
- 64-bit capable AMD processor or an Intel processor with EM64T
- 2 GB system memory (RAM) minimum, 8 GB recommended
- Graphics card supporting hardware accelerated OpenGL