Microsoft 365 Enterprise Administrator Expert (MS-101) Cert Prep 1 Plan and Implement Device Services
English | Tutorial | Size: 8.3 GB

Published 12/2022
Created by Gahlawat Technical Academy
MP4 | Video: h264, 1280x720 | Audio: AAC, 44.1 KHz, 2 Ch
Genre: eLearning | Language: English | Duration: 58 Lectures ( 14h 40m ) | Size: 5.9 GB

AI and Machine Learning for on-Device Development (1st Edition): A Programmer's Guide (Audiobook)
English | ASIN: B0BPZLZYXC | 2022 | 9 hours and 18 minutes | M4B@64 kbps | 246 MB
Author: Laurence Moroney
Narrator: Ray Greenley
AI is nothing without somewhere to run it. Now that mobile devices have become the primary computing device for most people, it's essential that mobile developers add AI to their toolbox. This insightful book is your guide to creating and running models on popular mobile platforms such as iOS and Android. Laurence Moroney, lead AI advocate at Google, offers an introduction to machine learning techniques and tools, then walks you through writing Android and iOS apps powered by common ML models like computer vision and text recognition, using tools such as ML Kit, TensorFlow Lite, and Core ML. If you're a mobile developer, this book will help you take advantage of the ML revolution today.

Semiconductor Device Fabrication Process by Prasun Barua
English | 2022 | ISBN: N/A | ASIN: B0BQMH2T2G | 290 pages | EPUB | 4.32 Mb
Welcome to Semiconductor Device Fabrication Process! This is a nonfiction science book which contains various topics on semiconductor device fabrication process. The process of fabricating semiconductor devices, which are primarily integrated circuit (IC) chips like modern computer processors, microcontrollers, and memory chips like NAND flash and DRAM found in common electrical and electronic equipment, is known as semiconductor device manufacturing. Electronic circuits are gradually built on a wafer consisting of pure semiconducting material using a multi-step sequence of photolithographic and chemical processing techniques such as surface passivation, thermal oxidation, planar diffusion, and junction isolation. Although different compound semiconductors are utilized for specialized applications, silicon is virtually always employed. From commencement to packaged chips ready for distribution, the process requires at least six to eight weeks excluding the circuit design, and it is carried out in highly specialized semiconductor fabrication plants, also known as foundries or fabs. The main area of a fab, the clean room, is where all fabrication takes place. Each semiconductor component product takes hundreds of processes to be produced. After sorting, the process is divided into eight steps such as wafer processing, oxidation, photography, etching, film deposition, interconnection, testing, and packaging. Thanks for reading the book.

The ASQ Certified Medical Device Auditor Handbook
by Laman, Scott A.;
English | 2021 | ISBN: 195307996 | 373 pages | True PDF | 5.37 MB

English | 2022 | ISBN: 9056990012 | 204 pages | True PDF | 58.32 MB
This title contains the most up-to-date and comprehensive information on the development of the Charge-Coupled Device (CCD), which makes possible the widespread use of consumer camcorders and broadcasting color cameras. It is comprehensive enough to be of great value to researchers, industrialists and post-graduate students in image technology.
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Merchant B The One Device The Secret History of the iPhone 2017 PDF | 4.19 MB
English | 377 Pages

Title: The One Device: The Secret History of the iPhone
Author: Merchant, Brian
Year: 2017

Ruiz J Device-Level Modeling and Synthesis Pipeline ADCs 2011 | 8.51 MB
English | 215 Pages

Title: 12 Rules for Life: An Antidote to Chaos
Author: Jordan B. Peterson
Year: 2018

Linux Device Driver Development:
Everything you need to start with device driver development for Linux kernel and embedded Linux, 2nd Edition
English | 2022 | ISBN: 1803240067 | 946 Pages | True PDF EPUB | 10 MB

ESD Protection Device and Circuit Design for Advanced CMOS Technologies by Oleg Semenov, Hossein Sarbishaei, Manoj Sachdev
English | PDF | 2008 | 237 Pages | ISBN : 1402083009 | 9.4 MB
The challenges associated with the design and implementation of Electrostatic Discharge (ESD) protection circuits are becoming increasingly complex as technology is scaled well into nano-metric regime. Traditional approaches of ESD design may not be adequate as the ESD damages occur at successively lower voltages in nano-metric dimensions. There are several challenges that must be met in order to design robust ESD circuits today. Due to technology scaling and proliferation of automated handling, ESD failures in ICs caused by Charged Device Model (CDM) are increasing. CDM discharges can cause latent damages which could degrade and eventually lead to definite failures in the ICs. The ESD protection design for current and future sub-65nm CMOS circuits is a challenge for high I/O count, multiple power domains and flip-chip products.